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Thermaltake Kandalf LCS Case

Price: $345.00


    Kandalf raised his magic wand and with one swing of the wrist, everything around became cold, the water in the lakes froze and the air was easier to breathe. A great opening for the start of a new Harry Potter book, but the Kandalf I’m talking about is the Thermaltake Kandalf LCS. This case comes complete with it own liquid cooling system that includes a radiator and pump large enough to cool your CPU (with the included water block), but also a VGA Card, Hard Drive and North Bridge chipset when the need arises to add some optional water blocks to your system.

Thermaltake Technology Co., Ltd. was founded in 1999, and in 2000 introduced the world’s first turbine cooler the Golden Orb. Thermaltake is a world leader in the supply of thermal management cooling solutions, as well as high end power supplies and computer cases for desktop PC’s and industrial applications. Thermaltake is also a supplier to computer manufacturers providing Intel validated and AMD approved CPU coolers for today’s mainstream and high frequency CPUs.

Closer Look:

    I expected the case to be fairly large considering it was a full tower, but when the box was delivered I couldn’t even believe the size of it. The external container came well packaged to protect the contents and after opening the box, I realized that was why the container was so big. The packaging has a picture of its contents on the front and back, while both sides are fairly plain.


Opening the box gave me my first glimpse of what I was about to expose. In-between two foam blocks and covered by a protective Tyvex cover was the case and looking up at me was the front bezel.


  1. Introduction & Closer Look
  2. Closer Look Continued (The Case)
  3. Closer Look Continued (Working Components)
  4. Closer Look Continued (Liquid Cooling)
  5. Closer Look Continued (Fluids and Fans)
  6. Installation
  7. Installation Continued (Liquid Cooling System)
  8. Specifications and Features
  9. Testing
  10. Testing Continued (Temperatures)
  11. Testing Continued (Motherboard and CPU)
  12. Testing Continued (Case Temperatures)
  13. Testing Continued (Air Flow)
  14. Testing Continued ( Inside Air Flow)
  15. Conclusion
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