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ENERMAX ETS-T40 Heatsink Review



Compatible Socket
Intel® LGA 775/1155/1156/1366/2011
AMD® AM2/AM2+/AM3/AM3+/FM1
Overall Dimensions
139(L) x 93(W) x 160(H)mm
Heatsink Dimensions
139(L) x 70(W) x 160(H)mm
Heat Pipe
4 x Ø6mm
Copper heat pipes, aluminum fins
Thermal Resistance
Thermal Grease
Dow Corning® TC-5121
Fan Dimension
120 x 120 x 25 mm
Fan Speed
800 ~ 1800 RPM
Air Flow
33.26 ~ 75.98CFM
Static Pressure
0.97 ~ 2.28mmH2O
Rated Voltage
Bearing Type
Twister Bearing
100,000 hours
16 ~ 26dBA
4 pin PWM connector
Circular Type Blue LED



  • World leading thermal resistance performance of 0.09°C/W
  • Patented VGF (Vortex generator flow) technology to greatly increase air convection.
  • Patented SEF (Stack Effect) design to enhance heat transfer.
  • Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
  • Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot.
  • Side flow type with four Ø6mm high performance heat pipes.
  • Patented circular type LED fan for the utmost eye-catching.
  • Dual fan installed option and solid springs attached.
  • Anti-vibration rubbers prevent fan vibration and absorb noise.
  • Universal bracket for Intel® 775/1155/1156/1366/2011 and AMD® AM2/AM2+/AM3/AM3+/FM1.
  • High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.


Information provided courtesy of ENERMAX @ http://www.enermax.com

  1. Introduction & Closer Look
  2. Closer Look (continued)
  3. Specifications & Features
  4. Testing & Setup
  5. Conclusion
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