Welcome Stranger to OCC!Login | Register

AMD-Intel Partnership Will Bring Custom Radeon GPU and HBM2 to Intel CPUs for Mobile

Category: General News
Posted: 09:07AM

There have been rumors about something like this for months, but they were either unconfirmed or denied, but now, with actual press releases from both companies, we know AMD and Intel have formed a partnership to combine strengths in the mobile sector. Under this partnership, AMD has created a new, semi-custom Radeon GPU that will be combined with HBM2 and an Intel CPU to offer a new mobile package meant to bring more power to ever thinner laptops.

This multi-chip design will leverage Intel's Embedded Multi-Die Interconnect Bridge (EMIB) to allow high-speed connections between the different parts, without the height and manufacturing penalties that can come from other approaches. This will be the first use of EMIB, and another technology that covers the chips, with this other being a power sharing framework. This system allows system designers to balance the power ratio between the processor and graphics depending on workload. It will also allow for managing temperatures between the chips, which is going to be very important, especially as the laptops this is targeting get thinner.

A reasonable thought to ponder now is where laptops using this Intel+Radeon design will fall in price and performance, especially as this announcement has come so shortly after AMD announcing its Ryzen Mobile parts. One would not think AMD would want to enable Intel to better compete with its own parts, so it may be very interesting to see where things fall, once the products start coming out. According to the Intel release, we can expect more to come in Q1 2018, including systems from OEMs.

Source: AMD and Intel

Register as a member to subscribe comments.

© 2001-2018 Overclockers Club ® Privacy Policy
Elapsed: 0.1741321087   (xlweb1)