Thermaltake Spedo Advance Package Review
Desja - December 1, 2008» Discuss this article (25)
Specifications:
|
Case Type |
|
|
Material |
SECC 0.8 mm |
|
Front Bezel Material |
Metal Mesh Color |
|
Color |
Black |
|
Side Panel |
Transparent window |
|
Motherboard Support |
ATX, |
|
Motherboard Tray |
No |
|
5.25" |
7 |
|
Ext. 3.5" |
1 (convertable from 5.25") |
|
Int. 3.5" |
6 |
|
Expansion Slots |
8 |
|
Front I/O Ports |
USB 2.0 x 2, |
|
Cooling System |
- Front (intake) : |
|
Liquid Cooling Capable |
Yes |
|
Liquid Cooling Embedded |
No |
|
Power Supply Supported |
Standard ATX PS2 |
|
Power Supply Included |
No |
|
Dimension (H*W*D) |
24.0 x 9.1 x 21.1 in |
|
Security Lock |
No |
|
Application |
High-End Gaming System |
Features:
- A.T.C.3 – Advance Thermal Chamber 3 provides maximum cooling & prevent hot air re-circulation
- C.R.M.3 – Cable Routing Management 3 eliminates cable cluster
- Independent Adjustable Fan bar
- Advance cable routing
- HDD Relocation canister
- Tool free design
- Fancool 8 – Installed up to 8 fans
- Wire-less side panel 23cm fan
- Superior air circulation design

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