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Thermaltake Level 10 Review

ccokeman    -   June 24, 2010
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In order to figure out just how the Thermaltake Level 10 stacks up in cooling efficiency, we must test it in "as delivered" condition. To do this, I will run a series of programs to stress-test the components installed in the chassis, while using temperature monitoring programs to measure the maximum temperatures reached by each component. To load the CPU and memory controller, I will use Prime 95 25.11 with a run time of 1 hour, and will average the highest temperatures recorded in Real Temp version 3.0. To stress-test the video card, I will loop 3DMark06 and use MSI Afterburner as my tool to monitor the temperatures delivered. For the board components, I will use the utility supplied with the board - MSI's Overclocking utility - to measure the system and IOH temperatures, taking the highest values for each. To load the hard drive, I will run a disk defrag and monitor the temperatures with HD Tune 4.01.



Testing Setup:


Comparison Cases:









The Level 10 did much better than I had anticipated in all four categories. The low CFM fans in the main compartment with the additional venting kept the temperatures competitive across the board, though CPU temperature did peak a little higher in this chassis. The additional airflow gained though having a power supply right above the CPU cooler, no doubt hurts this chassis in that department.

  1. Introduction & Closer Look
  2. Closer Look (The Case)
  3. Closer Look: Working Components
  4. Closer Look: Working Components (Continued)
  5. Specifications & Features
  6. Testing: Setup & Results
  7. Conclusion
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