Sapphire HD 6670 Low Profile ReviewRHKCommander959 - December 22, 2011
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The Sapphire HD 6670 LP is the fastest low profile card from the AMD team right now, providing much more performance than the 6450s and a decent amount over the 6570s as well. This card packs in 480 shader processors, 1GB of GDDR5 on a 128-bit memory bus, and doesn't require auxiliary power. Switching from the low profile brackets to the standard one is quite simple with a few basic tools — a pair of pliers or a small socket can remove the four hex-head standoffs and a Phillips head screw driver can handle the rest. The card is designed to only take up one slot of space. For cooling, the card uses a copper-based heat sink and low profile, two-wired blower motor to push air toward the expansion slots. Near the output is a small heat sink mounted separately by push-pins to cool the power circuitry. The back of the card is pretty simple. Under the blower motor are three vents cut into the PCB to help bring in air from both sides of the card. Four spring-loaded screws with plastic pads hold the main heat sink to the core, and the memory is passively cooled, but could easily be cooled by the heat sink with the addition of a few thermal pads for those looking for more performance. The fan connector is at the rear of the card, but this fan does not have an RPM sensor wire. The VGA low profile bracket can be easily removed if there isn't enough space or a need for it, as it simply plugs into the pins near the smaller heat sink.
When using the standard length mounting bracket, users will have to remove the hexagonal standoffs from the DVI and VGA port, and the screw from the HDMI port, then proceed by inserting the ports into the bracket and reinstalling the screw and standoffs. The bracket also has an extra screw that needs to be installed to help increase rigidity near the VGA end.
Removing the heat sinks reveals the major components that power this graphics card. The core is mounted at a 45° angle and four memory ICs sit near the fan vents. Four black tabs help disperse pressure from the heat sink more evenly. The core is also protected by a small black plastic shim. Near the output are four MOSFETs and two chokes that comprise the major power components that require the cooling from the smaller heat sink. The HD 6670 core has the AMD logo etched into it along with “Made in Taiwan”, as it was produced by TSMC. The memory ICs are 4x256M Hynix GDDR5 H5GQ2H24MFR-TOC.
Next up is the Specifications and Features page.