Phanteks PH-TC90LS Review

Phanteks PH-TC90LS Specifications:

Phanteks PH-TC90LS Features:

• PATS: Phanteks patented P.A.T.S (Physical Antioxidant Thermal Shield) technology dramatically increases the cooling performance and reliability of the PH-TC90LS by deflecting thermal radiation from other heat sources, such as GPU, South Bridge, North Bridge, and etc. In testing, P.A.T.S. display significantly good results in an enclosure and closed environment. P.A.T.S is environmentally friendly and non-toxic and is able to withstand temperatures of up to 200 degrees Celsius.
• CPSC:  Phanteks patented C.P.S.C (Cold Plasma Spraying Coating) Technology is a new innovative forming deposit that transfers heat onto corresponding metals at a more rapidly rate. With this technology, the PH-TC90LS enhances thermal conductivity on the soldered surfaces of the heat-pipes through the copper deposits.
• Ultra-low profile radiator, the PH-TC90LS is 43mm tall and compatible with small form factor case with a 45mm clearance. The three 6mm Heat-Pipes are aligned to ensure optimal cooling. The three copper heat-pipes are embedded for better contact and performance. The PH-TC90LS is made to ensure it has the least amount of air and thermal resistance. To prevent mechanical conflicts with other components, PH-TC90LS follow Intel’s Keep-Out-Zone (95x95mm) requirements.
• Phanteks PH-F90 PWM Premium fans uses UFB (Updraft Floating Balance) bearing, Nine blades and MAFO (Maelstrom Air-Fort Optimization) drive system to achieve massive airflow and perfect dynamic balance. The PH-F90 PWM fans with the support of the anti-acoustic rubber pad and rubber bar produces low level dB (A) and eliminates vibration. PH-F90 PWM fans provides a simple solution for quiet and smart fan control by adjusting fan speed according to the CPU load.
• PH-TC90LS only takes less than a minute to install. Thanks to the provided mounting kit, the PH-TC90LS only requires four screws and the rotational back plate for the Intel LGA 2011/1155/1156 to tightly secure it to the mainboard. By increasing the height of the rivets on the back plate, we designed the PH-TC90LS to avoid issues with other components (IC, E-SATA and etc...) that may be in the keep-out-zone and ensures the proper contact with CPU installation without bending the motherboard.
• Phanteks PH-NDC is made of high purity Nano diamond-like particles to improve the thermal conductance between components. The PH-NDC is a superb quality thermal compound for heat-sinks. Heat generated by CPUs will transfer to the heat-sinks without reduction in efficiency and resistance.

All information courtesy of Phanteks @ http://www.phanteks.com/01/PH-TC90LS.html