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Phanteks PH-TC14PE Review

airman    -   December 4, 2011
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Intel Socket LGA 2011/1155,1156, LGA 1366, LGA775 and AMD AM2/2+/AM3 (stock backplate required)
Copper (Base and 5 x ψ8mm Heat-pipes), Nickel Plated.

Alum. (Cooling Fins / Top Cover) with Patented P.A.T.S (Physical Anti-Oxidant Thermal Shield) to increase cooling performance.

Patented C.P.S.C Technology (Cold Plasma Spraying Coating Technology) to enhance thermal conductivity.
Fan Size
140x140x25 (qty 2 included)
Fan Compatibility
140x140x25mm x 3 pcs, (120 x 120 x25mm x 3 pcs).    (Third fan clips and accessory included).
Bearing Type
UFB bearing (Updraft Floating Balance bearing)
Blade Geometry
9 White colored Blades with MVB (Maelström Vortex Booster) Design
900~1200 RPM ± 10%
Air Flow
60.1~78.1 CFM ± 10%
Air Pressure
0.69~1.21 mm H2O
Noise Level
15.2~19 dBA
Input Power
Input Current
Rated Voltage
> 150,000 hours
Heatsink Dimension (w/o fan) LxWxH
Heatsink Dimension (w/ 2 fans)
Heatink Weight (w/o fans)
Heatsink Weight (with single/dual fans)
5 years



  • P.A.T.S (Physical Antioxidant Thermal Shield) greatly increases the cooling performance and reliability by deflecting other thermal radiation from other heat sources
  • C.P.S.C (Cold Plasma Spraying Coating Technology) is a brand new technologic forming deposit that displaces heat onto corresponding metals at a quicker rate
  • Five 8mm heat-pipes linearly aligned to ensure optimal cooling
  • Updraft Floating Balance (U.F.B) bearing and nine Maelstrom Vortex Booster (M.V.B) blades achieves massive airflow and perfect dynamic balance
  • Included PH-NDC thermal paste is made of high-purity nano diamond like particles to improve the thermal conductance between components


All information provided courtesy of PhanteksUSA @ http://phanteksusa.com/index.php?p=products_3&id=13&cate=1

  1. Introduction & Closer Look
  2. Closer Look (continued)
  3. Specifications & Features
  4. Testing & Results
  5. Conclusion
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