OCZ ReaperX HPC DDR3 10666 2 x 1 GB Reviewccokeman - January 1, 2008
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DDR3 modules are starting to come out fast and furious. With the frontside bus of the newest processors creeping up, system memory needs to move on up the frontside bus ladder to scale with the next generation of processors. Scaling upwards usually comes with penalties. Usually the timings and voltages are less than ideal so there have to be compromises. Either the timings are loosened up and performance suffers or voltage is increased causing a decreased life span due to heat and electromigration. It seems OCZ has found a way to deal with both issues with the release of its ReaperX HPC DDR3 1333MHz series of modules. The ReaperX HPC modules latencies are set to 6-5-5-20 at DDR3 1333MHz using 1.85 volts. By using a Heat Pipe Conduit that is in contact with the memory chips, the heat load generated by the modules is transferred to an extended fin array (put it simply, a heatsink). At this point the heat is dissipated into the surrounding airflow, effectively cooling the modules. This series of modules are available in both two and four gigabyte sets. Will low latency, voltage and an incredible looking cooling solution be the key to performance? Let's find out.
The OCZ Reaper X modules are a retail box set. The modules are in a standard plastic clamshell enclosure. The packaging prominently displays the Reaper X modules. The most prominent feature on the modules are the distinctive heatpipes and finned aluminum heatsinks. Considering that the required voltage to achieve the rated speed and timings is 1.85 volts, these modules may just need all the cooling help they can get. The voltage specification for DDR3 memory is 1.5 volts. The rear face of the packaging illustrates the benefits of the dual heatpipe cooling design.
The Reaper X HPC modules are designed to perform with tight latencies of 6-5-5-20 at DDR3 1333FSB speeds with 1.85volts. OCZ has designed an innovative way to keep the memory modules cool using heatpipe technology coupled with built in heatsinks to provide unsurpassed cooling to help maintain stability.
The pure copper heatpipes are installed so that each memory chip is in direct contact with it. Thermal tape is used to help manage the heat transfer process. With a direct exchange of heat from the module to the heatpipe to the heatsink, memory cooling should not be an issue. Each heatpipe loops up and over the Reaper modules and ends at what OCZ calls the "extended fin array."