OCZ DDR2 PC2-8000 2 x 2 GB Platinum Edition Reviewajmatson - February 21, 2008
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In today's times, computer systems and programs are requiring faster and higher capacity memory to perform very demanding tasks. The old sweet spot of 2GB of system memory is fading quickly with newer advanced programs and operating systems. DDR2 memory still continues to dominate the memory market and has speeds fast enough to please even the hardcore gamer. For those of you not wanting to jump ahead to DDR3, then this is the answer to your calls.
The OCZ Platinum Edition DDR2 PC2-8000 comes in sets up to 4GB total capacity. Today we are going to look at the 2 x 2GB set. Running operating systems like Windows Vista, you want to have the best bang for your buck. OCZ gives you a 4GB set in their Platinum Series to help you blow your competition away. The Platinum Edition runs at 1000MHz DDR2 speeds with latencies of 5-5-5-18 and all of this at 2.1v. A special feature that OCZ has on the Platinum Edition is EVP. EVP stands for Extended Voltage Protection, which allows you to run the modules at 2.15v while not invalidating your Lifetime Warranty.
The OCZ Platinum Edition memory comes packaged in a clamshell plastic colored with OCZ's traditional orange and brown colors. Included in the package are two 2GB matched modules. On the back, OCZ lists awards for the memory and quality, warranty, and support information, including an email and phone number for technical questions.
The OCZ Platinum Edition modules are manufactured to run at DDR2 1000MHz speeds, which is 500MHz x 2. The latencies for them are 5-5-5-18 at 2.1 volts. Using OCZ's EVP (Extended Voltage Protection) feature, you can push the voltage to 2.15 volts for overclocking without voiding the Lifetime Warranty.
The OCZ Platinum Edition DDR2 PC2-8000 generate a lot of heat at this voltage and speed, so OCZ uses the XTC style heatspreader. According to OCZ, "XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained."