Corsair Hydro H60 Reviewccokeman - January 6, 2013
» Discuss this article (4)
Corsair Hydro Series H60 Closer Look:
When pulled out of the box and laid out, the basic design elements are still similar to previous designs. A single depth aluminum radiator is attached to the pump head via low permeability tubing. Corsairs H60 cooling solution is designed to be used in any case that can accommodate a 120mm or larger fan on the back side or roof of the chassis.
The radiator used on this iteration of the H60 measures 120mm x 152mm x 27mm and is made from aluminum rather than copper. This brings up concerns about dissimilar metals with the copper cold plate, but past designs have lived well into the warranty period without failure or leakage due to the proprietary liquids used in the system. A new thicker wall tubing is used to attach the pump head/cold plate assembly to the radiator in place of the more rigid FEP tubing used on past iterations of the Hydro series. The larger tubing uses a compression style clamp to secure the connection and looks like it may be promoting higher flow rates. The tubing connects to the pump head by way of 90 degree barbed fittings coming from the side of the pump. While the tubing is more more forgiving, it is larger and creates some clearance concerns with all the DIMM slots filled.
The pump head is a radical departure from the past designs externally. The top is smaller and does not have the mounting brackets attached to the head. Rather, they slip over the head and lock into the top of the pump head. The liquid fittings continue to exit the side of the pump/cold plate assembly. Thermal paste is is pre-applied to the micro fin equipped copper base of the pump. Gone is the push button that sets the pump and fan speed by way of a three position switch. A single three-wire connection is used to power the pump assembly from either a four-pin Molex to three-pin adapter or directly off a motherboard header. The side opposite the tubing connections looks to be a fill port.
Corsair has included a new fan with this iteration of the H60 that offers improved airflow, lower noise and higher static pressure. Running at 12v, this fan runs at up to 2000RPM, pushes 54 CFM at 30.85 dBA. High static pressure is needed when using fans to push air through a radiator, rather than just pure volume that cannot make it through the radiator. In that respect, the fan has a static pressure rating of 2.36mm/H20.
Installing Corsairs new H60 High Performance Liquid CPU Cooler has not changed much from the previous designs. My test system is Intel socket 1155, so the coverage is shown for this platform. Mounting to an AMD system is a few steps shorter.
First you mount the back plate using the supplied stand-offs that screw into each leg of the back plate. Installing the fan/radiator is next, with four screws through the back or top 120mm fan attachment point. Face the fan so that it blows air in for optimum cooling, blowing air from inside the chassis, is going to offer similar performance if your chassis airflow is good enough to keep the internal air temperatures close to that of the outside air.
Follow up by slipping on the mounting bracket for the pump assembly, putting the one for your specific socket over the pump head and securing the four legs to the stand-off used to hold the back plate on. Caution here, as I found the fit incredibly tight between the tubing on the 90 degree fittings on the side of the pump and the memory modules closest to the CPU socket. If you are running with less than 4 DIMMs, then there is nothing to worry about.
A new easier to install design with an improved micro channel equipped pump and cold plate topped off with a better fan. Will this drive performance higher, or keep it static?