Gelid GC1 Thermal Compound Review

kendellrt - 2008-05-05 12:13:53 in Cooling
Category: Cooling
Reviewed by: kendellrt   
Reviewed on: June 14, 2008
Gelid Solutions
Price: TBA


Did you just go out and buy a new processor or CPU cooler, and you are looking all over for your tube of thermal interface material (TIM), and are unable to find it? Maybe you are not impressed with the results of your current thermal compound, and are looking for a new solution to keep your temperatures down? A new company named Gelid Solutions may have just the answer for you - it's called GC1 High Performance Thermal Compound. Gelid Solutions is a company that is new to the market, and is trying to make a good name for itself. I am interested to see how the GC1 TIM will compare to some of the other proven compounds.  

Closer Look:  

The packaging for the Gelid GC1 Thermal Compound is very simple, made of clear plastic that will allow you to see everything inside. In the lower right hand corner, you're able to see exactly how nice Gelid is - they put an extra 25% in the tube for free! Under that we see that there's a total of 5g of paste in the tube, which is quite a bit, and should last you quite some time. Gelid also decided to put the main features of their GC1 TIM on the front of the package - advertising optimal heat conductivity and low thermal resistance, while being non-corrosive, non-curing, and non-bleeding. When you get the product out of the package, you are able to see that the GC1 Thermal Compound comes in a green colored syringe for easy application. There is also a piece of plastic that you can use to spread the GC1 to cover the entire surface.





Now that we know what the Gelid GC1 Thermal Compound looks like, let's see how this TIM compares to others on the market.  





To properly test the Gelid GC1 Thermal Compound, I will need to record temperatures during both idle time (little to no CPU usage), as well as during a full load (100% CPU usage). I will be using SpeedFan 4.33 to gather the temperatures of the CPU cores. I will be using OCCT:PK to simulate a full load, and will be running it for 30 minutes. I will let the computer sit and cool down for a 30 minutes before recording the idle temperatures. I will be testing the processor at stock speeds with stock voltage settings, as well as overclocked speeds of 3.6GHz with the voltage increased to 1.51 volts.  

Testing Setup:


Comparison Heatsinks:












The Gelid GC1 Thermal Compound does exactly what it is supposed to do - adding a cushion between the processor and the cooler, and filling in any surface imperfections to enhance the thermal transfer between the CPU and cooler, and did it just as well as one of the top performers on the market right now, Arctic Silver 5. I was very impressed to see that at idle, the stock and overclocked temperatures were just about the same, and when the load was put on the processors, the GC1 was able to stay with the Arctic Silver 5 and even beat it in the Stock Load test. The temperatures when using GC1 were a little higher compared to those using the Arctic Silver 5; however, they were fairly similar throughout the testing. I also liked how Gelid Solutions packaged a plastic spatula with the TIM that you can use to spread the thermal compound on the processor, to help make sure that the application is uniform across the surface. Overall, I was very impressed by the Gelid Solutions GC1 High Performance Thermal Compound, and I would suggest it to anyone who is looking for a new compound to use.