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Gelid GC1 Thermal Compound Review

kendellrt    -   June 14, 2008
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Conclusion:  

The Gelid GC1 Thermal Compound does exactly what it is supposed to do - adding a cushion between the processor and the cooler, and filling in any surface imperfections to enhance the thermal transfer between the CPU and cooler, and did it just as well as one of the top performers on the market right now, Arctic Silver 5. I was very impressed to see that at idle, the stock and overclocked temperatures were just about the same, and when the load was put on the processors, the GC1 was able to stay with the Arctic Silver 5 and even beat it in the Stock Load test. The temperatures when using GC1 were a little higher compared to those using the Arctic Silver 5; however, they were fairly similar throughout the testing. I also liked how Gelid Solutions packaged a plastic spatula with the TIM that you can use to spread the thermal compound on the processor, to help make sure that the application is uniform across the surface. Overall, I was very impressed by the Gelid Solutions GC1 High Performance Thermal Compound, and I would suggest it to anyone who is looking for a new compound to use.

 

Pros:

  • Cooling results
  • Ease of use
  • Not electrically conductive
  • Large tube

 

Cons:

  • Slightly higher temperatures
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  1. Introduction & Closer Look
  2. Specifications & Features
  3. Testing
  4. Conclusion
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