ENERMAX ETS-T40 Heatsink Review

airman - August 1, 2012
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Specifications:

Compatible Socket	Intel® LGA 775/1155/1156/1366/2011 AMD® AM2/AM2+/AM3/AM3+/FM1
Overall Dimensions	139(L) x 93(W) x 160(H)mm
Heatsink Dimensions	139(L) x 70(W) x 160(H)mm
Weight	610g
Heat Pipe	4 x Ø6mm
Material	Copper heat pipes, aluminum fins
Thermal Resistance	0.09°C/W
Thermal Grease	Dow Corning® TC-5121
Fan Dimension	120 x 120 x 25 mm
Fan Speed	800 ~ 1800 RPM
Air Flow	33.26 ~ 75.98CFM
Static Pressure	0.97 ~ 2.28mmH2O
Rated Voltage	12V
Bearing Type	Twister Bearing
MTBF	100,000 hours
Noise	16 ~ 26dBA
Connection	4 pin PWM connector
LED	Circular Type Blue LED

World leading thermal resistance performance of 0.09°C/W
Patented VGF (Vortex generator flow) technology to greatly increase air convection.
Patented SEF (Stack Effect) design to enhance heat transfer.
Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot.
Side flow type with four Ø6mm high performance heat pipes.
Patented circular type LED fan for the utmost eye-catching.
Dual fan installed option and solid springs attached.
Anti-vibration rubbers prevent fan vibration and absorb noise.
Universal bracket for Intel® 775/1155/1156/1366/2011 and AMD® AM2/AM2+/AM3/AM3+/FM1.
High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.