Computex 2010 CoverageClayMeow -
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When it comes to high performance memory solutions, KINGMAX is probably not the first company that comes to mind. Maybe it's because I couldn't find its memory on sale in the U.S. or maybe it's because OCC has never reviewed a set. Whatever the reason may be, that may be about to change - Kingmax had the most impressive unveiling of all companies at Computex, in my opinion. KINGMAX was showing off its patented Nano Thermal Dissipation Technology. Put simply, RAM modules using Nano Thermal Dissipation Technology are not only able to run without a heat sink, but at a cooler temperature as well.
KINGMAX had a live demo running comparing 2x2GB DDR3-2200 with Nano Thermal Dissipation Technology to 2x2GB DDR3-2200 with a Hercules heat sink and 2x2GB DDR3-2200 with a normal heat sink. The Memtest86 photo below shows that the Nano Tech modules are entirely stable. The modules with the normal heat sink, although not pictured below, were throwing up error after error due to overheating. The real marvel is how the temperatures of the Nano Tech modules compare to the modules with the Hercules heat sink, which is KINGMAX's current high-end memory solution (see product image at bottom of page). The temperature for the Hercules modules was hovering around 41.5°C, while the Nano Tech modules averaged about two degrees cooler!
One of the coolest parts of my visit to the KINGMAX booth was getting to sit down with the president of the company for a Q&A session. I asked him about the possibility of licensing this technology to video card manufacturers, as the RAM chips on video cards get extremely hot and are often the toughest things to cool. After stating that I'm very smart for suggesting such a thing, he went on to say that it was certainly something he'd like to look into, as he agrees there is a lot of room for improvement in that aspect of cooling.
I'm definitely very impressed with this new technology and am eager to see it hit the market. As for KINGMAX's current offerings, here are photos of its dual and triple channel DDR3-2000 modules, as well as its DDR3-2200 modules featuring the aforementioned Hercules heat sink.