Computex 2008Kash - June 17, 2008
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Thermalright was another company whose booth I was looking forward to visiting.
Thermalright certainly knows how to design booths, with its latest products the first thing on display.
Before I even walked into the booth, I was introduced to one of the cases Thermalright is producing. The rep told me that they moved the motherboard further in, giving you more room to work between the board and the back panel. At first this seemed odd, because while cooling would certainly get a boost, I couldn't figure out how one would be able to access the IO ports at the back of the case. I was informed that Thermalright would have short 4" cables that would connect to the motherboard's back panel. While feasible, it certainly doesn't seem very practical.
Sitting next to the new case was Thermalright's heatsink for the Xbox360. The rep told me that this heatsink was on display at last year's Computex but nobody really paid much attention to it, but with the recent Red Ring of Death situation Microsoft has been facing, this product has garnered a lot of attention at this year's show.
The next case up on display is perhaps the most promising new product from Thermalright. The case essentially acts like a giant radiator to the built in liquid cooling system.
The last case on display is a horizontal model, perhaps good for a media center case. Thermalright incorporated a CPU heatsink into the case itself, with heatpipes drawing heat away from the processor to the top panel, which acts like a giant heatsink. Thermalright made the base of the heatsink broad enough to accomodate any shifts in the socket location.
The last thing on display were Thermalright's famous heatsinks, some of which were mounted on motherboards.
Thermalright had some new heatsinks on display, including the TRUE Black, the T-RAD2, the 140mm capable AXP-140, and smaller heatsinks for RAM and MOSFETs.