CES 2013 CoverageBosco - January 9, 2013
» Discuss this article (97)
As usual, Thermaltake had a pretty large selection of new and existing products to show off. To open up, we got a look at the new Chaser series of cases that range in price from $79 to $139 with a range of sizes from mid to full towers. Each case includes full USB 3.0 support and improved airflow designs. Each of these chassis are ready and able to use Thermaltake's Liquid Cooling solutions from the Water 2.0 to the Big Water series.
Next up is another new case series that is more elegant and understated than you traditionally see from Thermaltake called the Urban series. Again these cases come in a variety of sizes to fit the widest group of users. With each model, you get unique features including sound dampening, LCS compatibility, improved cable routing with grommet openings, and over an inch of space behind the motherboard tray. The front panel, while looking solid, actually opens up and has a series of standoffs that allow a tremendous amount of airflow through the front panel.
Thermaltake has upped its cooling game with the latest air and water coolers on display. Its NIC, or Non Interference Cooling, designs are built using a Direct Contact heat pipe design that takes into account one of the biggest challenges we find when installing large air cooling solutions on the latest crop of motherboards - interference with our high performance memory modules. Using a more efficient design that can be made thinner, these cooling solutions come in single-fan and dual-fan packages with thermal ratings from 160 to 230 watts of dissipation. Thermaltake's Water 3.0 systems are based on Asetek's Gen 4 pump and cooling plate and come in 120mm and 240mm packages, with performance tuning to suit several different levels of cooling. Not to be outdone, Thermaltake still has its in-house designed Bigwater 760 all-in-one system with an improved pump assembly and water block.