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CES 2011 Coverage

Bosco    -   January 7, 2011
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Mushkin

Today, our path took us to Mushkin to take a look at what the company has to offer in the upcoming year. We got a quick look at some of the upcoming Ridgeback line modules that we at OverclockersClub have had the privilege of using. There were two sets on display, as well as a little something new coming out shortly in its new Hammerhead line made for the water cooling enthusiast. The Redline Ridgeback set part number 996973 is a 4GB kit with latencies of 9-11-9-27 at 2133MHz, while the Black set part number 996981 is rated for operation at 1600MHz with latencies of 9-9-9-24. Both run at the Intel specified 1.65v.

 

 

 

 

 

 

 

 

The Joule lineup of power supplies gets a refresh with the models gaining 80+ Bronze certification, adding another notch in their belt. This means that not only can you get good stable power, but high power efficiency as well.

 

 

The most interesting thing we saw was an EXCLUSIVE LOOK at a product that is targeted squarely at the enthusiast community — the Hammerhead memory modules and water cooling system. The Hammerhead modules come with the same cooling fins as the Ridgeback line as the standard cooling option. For those who would like to get a little more extreme with their cooling, you can purchase the modules with the liquid cooling solution. What looks like just a flat copper plate is a little bit more. Unfortunately, we were not able to remove the Delrin cover on the block, but were told there are Micro channels in the copper plate for excellent heat transfer. Screwed into the Delrin cover are what look like Bitspower compression fittings. These should be available in both 1/2" and 3/8" sizes. When asked why not a barbed fitting, the reply was that the compression fitting was a better solution to prevent leaks in the long term.

 

 

 

We were told that the Hammerhead would support all memory configurations up to a triple channel 6-DIMM setup with adequate spacing between the modules for added airflow over the modules. To connect the modules to the copper water block, you will need to remove the Ridgeback heat sinks (fins), install them in the DIMM slots, and then attach the block to the modules. There are three pre-drilled holes on each side of the block for a standard three-module spacing used on Intel X58 motherboards. But on top of that, there are slots that the screws ride in when using different memory combinations.

 

 

There are several liquid cooling solutions on the market, but this looks like a really solid combination with excellent cooling potential, which should bring another level of performance to this series. Look for a review coming up on OverclockersClub.com. When speaking with Mushkin, it looks like things are looking up, with increased support for and from the community.




  1. Pre-CES Part 1: Introduction & Corsair Press Event
  2. Pre-CES Part 2: Sapphire
  3. Pre-CES Part 3: Gigabyte Press Event
  4. CES Day 1 Part 1: Sennheiser
  5. CES Day 1 Part 2: Antec
  6. CES Day 1 Part 3: IN WIN
  7. CES Day 1 Part 4: LG Electronics
  8. CES Day 1 Part 5: LG Electronics (Continued)
  9. CES Day 1 Part 6: Samsung
  10. CES Day 1 Part 7: Corsair
  11. CES Day 1 Part 8: The CA Technologies Race
  12. CES Day 1 Part 9: The CA Technologies Race (Continued)
  13. CES Day 1 Part 10: MSI MOA 2011 Americas Finals
  14. CES Day 1 Part 11: MSI MOA 2011 Americas Finals (Continued)
  15. CES Day 2 Part 1: MSI
  16. CES Day 2 Part 2: MSI (Continued)
  17. CES Day 2 Part 3: Sony
  18. CES Day 2 Part 4: Zotac
  19. CES Day 2 Part 5: Mushkin
  20. CES Day 2 Part 6: Patriot Memory
  21. CES Day 2 Part 7: OCZ Technology
  22. CES Day 2 Part 8: Advanced Micro Devices
  23. CES Day 2 Part 9: Palit
  24. CES Day 3 Part 1: Creative Labs
  25. CES Day 3 Part 2: Shuttle
  26. CES Day 3 Part 3: NVIDIA
  27. CES Day 3 Part 4: PowerColor
  28. CES Day 3 Part 5: Razer
  29. CES Day 3 Part 6: Razer (Continued)
  30. CES Day 3 Part 7: Super Talent
  31. CES Day 3 Part 8: SD Association, Supermicro, Mad Catz, NEC
  32. CES Day 3 Part 9: Thermaltake
  33. CES Day 3 Part 10: Thermaltake (Continued)
  34. CES Day 3 Part 11: CyberPower PC
  35. CES Day 3 Part 12: Cooler Master
  36. CES Day 3 Part 13: Cooler Master (Continued)
  37. CES Extras: Cooler Master Party
  38. CES Extras: Bartenders, Sharp i3 Wall, Magician
  39. CES Extras: Convention Center, Counter-Strike 1.6 vs. EG.n0thing
  40. CES Extras: Booth Babes Part 1
  41. CES Extras: Booth Babes Part 2
  42. CES Extras: Booth Babes Part 3
  43. CES Extras: Booth Babes Part 4
  44. CES Extras: Booth Babes with Staff
  45. CES Final Thoughts
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