Antec Three Hundred Two Case Review
BluePanda - November 7, 2012» Discuss this article (13)
Testing:
Testing the Antec Three Hundred Two required pushing my hardware to heat things up as much as possible. Testing involved recording temperatures for the CPU, GPU, chipset, hard drives, and overall system during idle and load phases. Recently, OCC upgraded to the ForceGT 240GB SSD from Corsair and has removed the HDD temps from case reviews. Thus, HDTune is no longer a part of the case benchmarking process.
Load was simulated by running Prime95’s small FFTs along with 3Dmark Vantage looping for one hour. The maximum temperatures were recorded using HW Monitor. It is important to note that each case is tested from its factory setup, including location of fans, unless otherwise noted.
Testing Setup:
- Processor: Core i7 2600K @ 4.4 GHz 100 x 44
- CPU Cooling: Noctua NH-U12P SE 1366
- Motherboard: GIGABYTE Z68AP-D3
- Memory: Mushkin 991996 Redline PC3-17000 9-11-10-28 8 GB
- Video Card: XFX HD 7970
- PSU: Antec TruePower New TP-750
- Storage Drive: Corsair ForceGT 240GB
- Optical Drive: N/A
- OS: Windows 7 Pro 64-Bit SP1
Comparison Cases:
- AZZA Genesis 9000W
- CM Scout 2
- CM Stryker
- Corsair 300R
- Corsair 550D
- Corsair 600T
- Corsair 650D
- Corsair C70
- COUGAR Evolution
- COUGAR Solution
- Game Tiger Mage Mi-3
- Game TIger Tiger As-19
- Game TIger T-Rex Fr-16
- Cooler Master HAF XM
- Raidmax Orion
Results:
Temperatures seen in this case were all over the place. It wasn't a sure winner, nor a real loser in the all-around category. In terms of CPU temperatures, it was a bit high at idle but seemed to be one of the lower ones under load. The video card seemed to stay nice and cool under load and at idle. I'm not sure if it's the top fan helping out, but it does well and that is what counts. The chipset on the other hand is what turns the smile upside-down. Both idle and load are top of the charts; not impressive at all. Overall it rounds out, but I'm thinking if you add in an extra fan or two you might be able to bring down the chipset closer to ambient temperature.

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