Representatives from Intel and IBM presented papers detailing new 22nm technology at the International Electron Devices Meeting in San Francisco yesterday. IBM is using a 3D process to create server processors with performance that is 25-35% greater than current 32nm technology. IBM plans to further discuss the 3D technology on Wednesday. Intel has created several variations to its 22nm process for system on a chip units. This offers performance improvement up to 65% over Intel's 32nm planar process. The process will also offer increased performance in fast interface devices such as Ethernet and HDMI.