Intel announced today its new Xeon Phi co-processor lineup, which is to incorporate Intel's Many Integrated Core (MIC) architecture. The new Xeon Phi co-processors are being packaged in discrete graphics card-like form to work in tandem with Intel's Xeon E5 family of server and workstation processors. According to Intel, the Xeon Phi is the accumulation of eight years of work to produce a chip to tackle both high performance computing (HPC) and super-computing markets. This puts it in competition with products like the NVIDIA Tesla K20 series and AMD's recently announced FirePro S10000 series.
Some key specifications of the Xeon Phi are a 22nm manufacturing process with Intel 3-D Tri-Gate transistors, up to 60 cores/1.053 GHz/240 threads, 1 teraflops of double-precision performance, 8 GB GDDR5 memory and 320 GB/s of memory bandwidth, 512-bit memory interface, 32 KB L1 I/D cache, 512 KB L2 cache per core (30MB total), 225W TDP, and a PCIe x16 form factor. Intel reports that the Xeon Phi co-processors are to become generally available on January 28, 2013, with the Xeon Phi 5110P priced at $2,649 and the Xeon Phi 3000 family to be priced under $2,000 per SKU.