IBM is hard at work on the Power 7+ CPU, and the early pictures are rather impressive. The photo shows four different chips, with two different orientations. Two of the CPUs feature four 32nm cores on an interposer. The CPU is then able to be mounted on both ceramic and organic packaging. The interposer itself features a large deal of cache with a very fast interface, which should allow for tremendous speeds. The other two chips shown feature multiple dies stacked on top of each other, both with and without a cover. While the information currently available seems impressive, I would certainly like to see further information before making any judgments about the Power 7+.