One of the Biggest Partnerships in PC History About to Happen

Prunes - September 28, 2011 12:30PM in Manufacturers

It appears that one of the biggest partnerships in PC history is about to happen. According to Andrew M. Cuomo, Governor of New York, Intel, IBM, GlobalFoundries, TSMC and Samsung will be teaming up for a $4.4 billion investment in New York State, which intends to create 6,900 jobs, with 2,500 high-tech jobs in Albany, Utica, East Fishkill and Canandaigua. Intel is going to build its 450mm East Coast Headquarters in Albany. Intel's push toward the 450mm wafers is supported by TSMC, while IBM and GlobalFoundries are more hesitant. Paul Otellini, President and CEO of Intel Corp., explains that the move to 450mm is a crucial element to moving the semiconductor industry to the next generation wafer size. It will allow Intel to reduce the production costs, increase productivity, while becoming more environmentally clean.