3D is seemingly everywhere, from video games to movies and even photographs. Intel is getting on the 3D bandwagon, but not in a typical way you'd expect. The company has just announced it will mass produce 3D transistors for all future chips, starting with the 22nm Ivy Bridge ones. This 3D transistor, Intel calls it "Tri-Gate," will consume 50% less power, conduct more electricity, and provide 37% more speed than 2D counterparts thanks to its vertical fins of silicon substrate that stick up through other layers. Those vertical fins could make for cheaper chips down the road, but currently Intel expects a two to three percent increase in cost. The 3D transistors will also allow for smaller chips, beginning with the 22nm Ivy Bridge CPUs that will begin production in the second half of this year. Intel will follow that up with 14nm chips in 2013 and 10nm chips in 2015. Intel also plans to incorporate the 3D transistors in everything it makes, including mobile products.