MIT Making Next Advancement in CPU Design
Category: CPU'sPosted: September 17, 2009 04:30PM
Author: CheeseMan42
A team of engineers and computer scientists from MIT have announced a new development in processor technology. The new method involves using two semiconductor materials instead of just one in the substrate layer. This is important as the current processor technology will hit a wall at some point due to current leakage among other things. The technique is currently in the early stages and cannot yet match the wafer dimensions of current technology. The researchers are working on this, and hope to have the technology ready for mainstream adoption within a few years.

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