IBM researchers are working on a multi-layer CPU chip that stacks the components of the processor vertically instead of placing them next to each other in a horizontal layout. The beauty of this type of design is that it increases the number of possible interconnections and shortens the distance information needs to travel. The drawback to this approach is that it traps heat between the layers. To combat the heat issue, IBM scientists are incorporating water cooling directly into the chip itself using micropipes as thin as a human hair in between the layers. Destined for use in supercomputers, this type of chip is at least five years away from commercial production.