OCZ Technology Announces "Freeze" Extreme Thermal Compound

Category: Cooling, CPU Cooling
Posted: December 5, 2007 03:04AM
Author: Nemo

OCZ Technology -

OCZ Technology recently released a new thermal compound, Freeze, based on a proprietary formula of thermally conductive ingredients.  Marketed toward enthusiasts and overclockers, the new formulation is designed to have have higher thermal conductivity and lower heat resistance.  Freeze can achieve as much as a ten percent reduction in CPU temperatures over conventional silver-based compounds.    "Transfer rates are highly dependent on the thermal conductance of any interface material along with its spreadability—the higher the spreadability, the thinner the interface layer will be, resulting in better heat transfer between the IC and the cooler. The new Freeze Extreme Conductivity Thermal Compound, based on a novel formula of environmentally-safe, non-silver based components, combines low viscosity with high thermal conductivity for superior performance compared to even our own leading products." according to Dr. Michael Schuette, VP of Technology Development at OCZ Technology.

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